Global semiconductor manufacturers are confronting persistent production bottlenecks driven primarily by advanced packaging constraints rather than raw wafer fabrication limits. As demand for artificial intelligence accelerators rises, lead times for high-bandwidth memory (HBM) modules remain extended.
Capital Allocation Shifts
Major foundries are reallocating capital expenditure toward 2.5D and 3D packaging facilities. Market forecasts indicate high-end packaging capacity will grow 35% year-over-year through 2025, though near-term supply gaps will keep pricing elevated.