While global investments in wafer fabrication foundries have expanded, industry bottlenecks have migrated downstream to advanced packaging technologies such as Chip-on-Wafer-on-Substrate (CoWoS). High-performance computing chips depend heavily on these back-end processes.
Capital Expenditure Realignment
Major semiconductor foundries are reallocating capital expenditure to build integrated packaging facilities in North America and Europe. However, operational ramps are constrained by specialized material availability and a shortage of advanced packaging cleanroom technicians.