Global semiconductor manufacturers are reallocating capital toward regional advanced packaging plants. Driven by geopolitical tensions and supply chain vulnerabilities exposed over the past three years, key players are shifting away from centralized assembly models in East Asia.
Capital Allocation and Infrastructure
Foundries in North America and Europe have committed over $40 billion to back-end fabrication through 2026. Advanced packaging techniques, such as 3D stacking and chiplet integration, require high capital expenditure but offer crucial resilience against single-point trade bottlenecks.