Global semiconductor foundries are increasingly turning to advanced packaging technologies to sustain performance gains. As sub-2nm node scaling hits physical and financial hurdles, chipmakers are prioritizing 2.5D and 3D integration to interconnect heterogeneous chiplets efficiently.
Capital Reallocation
Major fabricators have adjusted 2024 capital expenditure forecasts, shifting up to 18% of front-end fab budgets toward advanced packaging facilities. This transition allows firms to boost bandwidth and reduce latency without relying solely on next-generation extreme ultraviolet lithography tools.