Global semiconductor manufacturers are pivoting investments toward advanced packaging facilities as silicon scaling encounters physical and economic limits. Major players are expanding Chip-on-Wafer-on-Substrate capacity to meet high-performance computing demand.
Capital Realignment
Capital expenditure reports indicate a 35% year-over-year increase in packaging infrastructure spending across North America and East Asia. This transition reflects a structural shift where system-level optimization yields higher efficiency gains than transistor miniaturization alone.