Leading semiconductor foundries are directing capital expenditure toward advanced packaging facilities as 3D stack architecture becomes essential for high-performance AI processors. Demand for high-bandwidth memory integration currently exceeds existing substrate supply.
Geographic Diversification of Packaging Supply Chains
To mitigate geopolitical risk, chipmakers are establishing assembly and test facilities across Southeast Asia and North America. Analysts indicate that packaging throughput, rather than silicon wafer fabrication, will dictate AI accelerator supply through 2025.