Global semiconductor manufacturers are adjusting capital expenditure strategies, diverting funds from traditional wafer fabrication to advanced 2.5D and 3D packaging capabilities. Driven by compute-heavy artificial intelligence workloads, the industry bottleneck has transitioned from front-end silicon fabrication to back-end interconnect density.
CapEx Reallocation Strategy
Foundries report that packaging capacity remains booked through the fourth quarter. Investment in high-bandwidth memory (HBM) integration is projected to rise 35% year-over-year, forcing suppliers to modularize manufacturing footprints near regional assembly hubs.