Global semiconductor manufacturing is undergoing a structural shift driven by exponential increases in capital expenditure. Developing sub-2nm process nodes now requires advanced High-NA EUV lithography systems, driving fab construction costs beyond $20 billion per site.
Capital Realities and Market Impact
Foundries are increasingly forming strategic alliances to offset research and development risks. Tier-two manufacturers are abandoning leading-edge expansion entirely, pivoting instead to mature power management and automotive microcontroller nodes where margins remain stable.