As traditional semiconductor scaling faces physical and economic constraints, leading foundries are allocating significant capital to advanced chip packaging facilities. Heterogeneous integration is replacing monolithic die designs in high-performance computing.
Chiplet Architecture
Combining specialized silicon dies onto a single interposer allows manufacturers to maximize yields and combine different process nodes efficiently. Demand from high-performance computing and AI accelerators is outstripping existing packaging capacity.
Capital Allocation
Foundries plan to double advanced packaging capital expenditure over the next two fiscal years, prioritizing multi-die assembly facilities near primary wafer fabrication sites to streamline logistics.