Semiconductor foundries are shifting capital expenditure toward advanced chiplet packaging solutions as traditional lithographic node scaling hits physical and financial constraints. Interconnect density and thermal dissipation have emerged as primary bottlenecks for next-generation hardware designs.
Substrate Procurement Constraints
Demand for high-density organic substrates and silicon interposers has tightened lead times across supply chains. Foundries are collaborating with packaging specialists to secure dedicated capacity for high-performance computing clients through 2027.