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Semiconductor Foundry Bottlenecks Shift Toward Advanced Packaging

 ·  1 min read

Global semiconductor manufacturers are pivoting capital expenditure toward advanced packaging infrastructure as physical limits constrain traditional front-end node shrink.

Capital Allocation Shifts
Foundries are reallocating up to 20 percent of expansion budgets to silicon interposers and high-bandwidth memory integration, aiming to bypass transistor density ceilings.