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Semiconductor Foundry Bottlenecks Shift Toward Packaging Infrastructure

 ·  1 min read

Global semiconductor supply chains face a structural pivot as high-bandwidth memory integration and 2.5D/3D packaging outpace front-end fabrication capacity demands.

Capital Expenditure Realignment
Foundries are reallocating billions from raw node shrink to back-end assembly facilities. Analysts project advanced packaging investments will grow 18 percent annually through 2026 to resolve critical interconnect bottlenecks.