Tight supply constraints in Ajinomoto Build-up Film (ABF) substrates are creating production bottlenecks for high-performance computing hardware manufacturers. Lead times for specialized multi-chip module packaging have extended to 30 weeks across key Asian foundries.
Capital Investment and Foundry Responses
Foundries are committing $4 billion toward substrate manufacturing capacity, but capacity expansion projects are not projected to reach full yield until late next year. Equipment vendors are prioritizing key enterprise clients to maintain strategic supply pipelines.