As physical limits restrict traditional silicon node shrinkage, semiconductor foundries are prioritizing advanced packaging architectures. Interposer technology and direct copper bonding allow heterogeneous chiplets to operate with reduced interconnect latency.
Capital Investment in OSAT Capacity
Outsourced Semiconductor Assembly and Test (OSAT) providers are expanding capital expenditure to build high-density packaging lines. Yield management in multi-chiplet modules remains the primary operational variable impacting gross margins.