Major semiconductor fabricators are expanding advanced packaging capacity across Southeast Asia and Eastern Europe. The move aims to hedge against operational disruptions in traditional manufacturing nodes.
Packaging Bottlenecks
While front-end wafer fabrication gets significant subsidy focus, backend packaging remains a critical supply chain bottleneck. Modern AI chips require high-density interconnects, driving regional capital allocation.
Geopolitical Resilience
Multi-region assembly strategies are now standard corporate governance requirements for Fortune 500 electronics firms seeking supply contract continuity.